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HOME
ABOUT US
PCB
Automotive Products
Industrial Control Electronics
Consumer Electronics
Medical Appliance Electronics
Telecom Electronics
High Frequency Microwave Electronics
Special Electronics
PCB ASSEMBLY
FPGA BGA Assembly Patch
Intelligent Electronics
Medical PCB Board
Automotive
Consumer Electronics
MANUFACTURING TECHNOLOGY
Process Capability
Production Equipment
Testing Equipment
Inspection Equipment
Quality Assurance
System Certification
COMPANY
NEWS
CONTACT
English
简体中文
Deutsch
Español
Русский язык
بالعربية
PCB
Automotive Products
Industrial Control Electronics
Consumer Electronics
Medical Appliance Electronics
Telecom Electronics
High Frequency Microwave Electronics
Special Electronics
PCB
R-FPC
Layers:8L
Thickness:硬板 1.95-2.35mm FPC 0.66±0.06mm
Min.Hole Size:0.6mm
Min.line Width/Space:0.122mm
Inner Layer Copper Thickness:H/HOZ
Outer Layer Copper Thickness:45-60μm
Surface Finish:HASL
Min.Clearance of Hole to Line:0.38mm
Factory:Meizhou
High-frequency Hybrid Board
Layers:6L
Thickness:1.1mm
Min.Hole Size:0.3mm
Min.line Width/Space:0.15mm
Inner Layer Copper Thickness:LOZ
Outer Layer Copper Thickness:HOZ+plating
Surface Finish:Gold Plating
Min.Clearance of Hole to Line:0.25mm
Factory:Shenzhen
PTFE Multiple Board
Layers:4L
Thickness:4.8mm
Min.Hole Size:0.5mm
Min.line Width/Space:0.15mm
Inner Layer Copper Thickness:LOZ
Outer Layer Copper Thickness:LOZ+plating
Surface Finish: ENIG
Min.Clearance of Hole to Line:0.35mm
Factory:Shenzhen
1.3m Backboard
Layers:8L
Thickness:3.2mm
Min.Hole Size:0.4mm
Min.line Width/Space:0.25/0.25mm
Inner Layer Copper Thickness: 1OZ
Outer Layer Copper Thickness:2OZ
Surface Finish: OSP
Min.Clearance of Hole to Line:OSP
Factory: Shenzhen
2 Step HDI Board
Layers:6L
Thickness:0.3±0.05mm
Min.Hole Size:0.6mm
Min.line Width/Space:0.05/0.05mm
Inner Layer Copper Thickness:T/TOZ
Outer Layer Copper Thickness:15-33μm
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.2mm
Factory:Meizhou
Any-layer HDI Board
Layers:4L
Thickness:0.3±0.05mm
Min.Hole Size:0.3mm
Min.line Width/Space:0.0508/0.084mm
Inner Layer Copper Thickness: H/HOZ
Outer Layer Copper Thickness:17-23μm
Surface Finish:ENEPIG
Min.Clearance of Hole to Line:0.2mm
Factory: Meizhou
3 Step Golden Finger Board
Layers:10L
Thickness:1.0mm
Min.Hole Size:0.1mm
Min.line Width/Space:0.075mm/0.075mm
Inner Layer Copper Thickness:35μm
Outer Layer Copper Thickness:35μm
Surface Finish:ENIG+OSP+Beveling of G/F
Min.Clearance of Hole to Line:0.16mm
Factory:Jiangsu
Through-hole Memory Board
Layers:6L
Thickness:1.6mm
Min.Hole Size:0.2mm
Min.line Width/Space:0.075mm/0.075mm
Inner Layer Copper Thickness:35μm
Outer Layer Copper Thickness:35μm
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.16mm
Factory: Jiangsu
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