Medical Appliance Electronics
Multilayer Board
Layers:16L
Thickness:2.0mm
Min.Hole Size:0.2mm
Min.line Width/Space:0.08mm
Inner Layer Copper Thickness:HOZ
Outer Layer Copper Thickness:1OZ
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.16mm
Factory:Meizhou
R-FPC
Layers:8L
Thickness:0.8mm
Min.Hole Size:0.2mm
Min.line Width/Space:3.5/3mi
Inner Layer Copper Thickness:HOZ
Outer Layer Copper Thickness:1OZ
Surface Finish:ENIG
Min.Clearance of Hole to Line: 0.18mm
Factory: Meizhou
Through-hole Board
Layers:14L
Thickness:2.0mm
Min.Hole Size:0.25mm
Min.line Width/Space:0.1mm/0.1mm
Inner Layer Copper Thickness:18μm
Outer Layer Copper Thickness:35μm
Surface Finish: ENIG
Min.Clearance of Hole to Line:0.2mm
Factory:Jiangsu
First-order HDI Board
Layers:12L
Thickness:1.6mm
Min.Hole Size:0.45mm
Min.line Width/Space:0.09mm/0.1mm
Inner Layer Copper Thickness:18μm
Outer Layer Copper Thickness:25μm
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.18mm
Factory: Jiangsu