SMT daily production capacity: over 30 million points
Mounting speed: Chip component mounting speed (optimal state) 0.036 S/chip
Minimum adhesive size: 0201, with an accuracy of ± 0.04mm
Minimum device accuracy: Can be used to mount PLCC, QFP, BGA, CSP and other devices, with a pin spacing of up to ± 0.04mm
IC type SMT accuracy: It has a high level of precision in mounting ultra-thin PCB boards, FPC PCB boards, gold fingers, etc. High difficulty products such as TFT display driver boards, battery protection circuits, etc. that can be mounted/inserted/mixed
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