High Frequency Microwave Electronics
High-frequancy Multilayer Board
Layers：4L
Thickness：2.0mm
Min.Hole Size：0.3mm
Min.line Width/Space：0.175mm
Inner Layer Copper Thickness：HOZ
Outer Layer Copper Thickness：1OZ
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.18mm
Factory：Shenzhen
High-frequency Embedded Copper Coin
Layers：6L
Thickness：3.0mm
Min.Hole Size：0.3mm
Min.line Width/Space：0.25mm
Inner Layer Copper Thickness：1OZ
Outer Layer Copper Thickness：1OZ+Plating
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.2mm
Factory：Shenzhen
Cu-based Board
Layers：4L+铜基
Thickness：5.6mm
Min.Hole Size：0.35mm
Min.line Width/Space：1.25mm
Inner Layer Copper Thickness：HOZ
Outer Layer Copper Thickness：1OZ
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.185mm
Factory：Shenzhen
1.2m Antenna Board
Layers：2L
Thickness：0.6mm
Min.Hole Size：0.8mm
Min.line Width/Space：0.12mm
Inner Layer Copper Thickness：/
Outer Layer Copper Thickness：1OZ
Surface Finish： Immersion Tin
Min.Clearance of Hole to Line：/
Factory：Shenzhen
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