Industry scale: From the graph, it can be seen that the overall scale of the new PCB industry in China and globally has shown an increasing trend from 2019 to 2023. The global new PCB industry reached a peak of 7.99 billion US dollars in 2021, and the scale of China's new PCB industry has continued to rise in various years.
High market share: According to Prismark data, in the global PCB market size in 2023, the Chinese Mainland will account for 54.4%, and Taiwan, China will account for 12.5%, a total of 66.9%. It is estimated that in 2028, Chinese Mainland will account for 51.1% of the global PCB sales, and Taiwan, China will account for 13.7%, a total of more than 64.8%.
High density: With the development of electronic products towards miniaturization and high performance, PCBs will move towards higher density and precision, such as more advanced packaging substrate technology and rigid flex bonding board technology, which will be widely applied.
In 1903, German inventor Albert Hansen pioneered the use of the "line" concept in telephone exchange systems, which was the prototype of modern PCB manufacturing. In 1925, Charles Ducas of the United States printed circuit patterns on insulated substrates and then established conductors for wiring through electroplating, giving rise to the term "PCB".
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