• Origin exploration stage (1900-1940): In 1903, German inventor Albert Hansen pioneered the use of the "line" concept in telephone exchange systems, which was the prototype of modern PCB manufacturing. In 1925, Charles Ducas of the United States printed circuit patterns on insulated substrates and then established conductors for wiring through electroplating, giving rise to the term "PCB". In 1936, Austrian Paul Eisler used printed circuit boards in his radio equipment, which was the most similar method to today's printed circuit boards.
• Initial development stage (1940s -1950s): In 1943, Americans used PCB technology in a large number of military radios. In 1947, epoxy resin began to be used for manufacturing substrates, while NBS began researching manufacturing techniques such as coils, capacitors, resistors, etc. using printed circuit technology. In 1948, the United States officially recognized the invention of PCB for commercial use. In the early 1950s, copper foil etching became the mainstream of PCB manufacturing technology and began producing single panels. In 1953, Motorola developed double-sided panels using the electroplating through-hole method.
• Rapid development stage (1960-2000s): In the 1960s, large-scale production of hole metalized double-sided PCBs was achieved, and multi-layer printed circuit boards began to emerge. In 1960, V. Dahlgreen produced flexible printed circuit boards. In the 1970s, multi-layer PCBs rapidly developed towards high precision, high density, and other directions. In the 1980s, surface mount printed boards (SMT) gradually replaced plug-in PCBs as the mainstream of production. In the 1990s, surface mount technology evolved from flat packaging (QFP) to ball grid array packaging (BGA). In the 21st century, high-density BGA, chip level packaging, and multi chip module packaging printed boards with organic laminate materials as substrates have experienced rapid development.
PCBA has developed on the basis of PCB, and its development is closely related to the development of PCB. In the early days, PCBA mainly installed electronic components on the PCB through manual soldering or plug-in. With the continuous advancement of PCB technology and the development of surface mount technology (SMT), the production process of PCBA is gradually achieving automation and scale. After the 1990s, with the development of electronic products towards miniaturization and high performance, PCBA also developed towards high density, high precision, and high reliability. Technologies such as layered printed circuit boards emerged, and at the same time, PCBA testing and quality control became increasingly important.
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