Shenzhen JingSu Youngs Electronics Co . ,Ltd.
English
English 简体中文 Deutsch Español Русский язык بالعربية
English 简体中文 Deutsch Español Русский язык بالعربية
PRODUCTS
PCB
PCB
High-frequancy Multilayer Board
High-frequancy Multilayer Board
Layers：4L
Thickness：2.0mm
Min.Hole Size：0.3mm
Min.line Width/Space：0.175mm
Inner Layer Copper Thickness：HOZ
Outer Layer Copper Thickness：1OZ
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.18mm
Factory：Shenzhen
High-frequency Embedded Copper Coin
High-frequency Embedded Copper Coin
Layers：6L
Thickness：3.0mm
Min.Hole Size：0.3mm
Min.line Width/Space：0.25mm
Inner Layer Copper Thickness：1OZ
Outer Layer Copper Thickness：1OZ+Plating
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.2mm
Factory：Shenzhen
Cu-based Board
Cu-based Board
Layers：4L+铜基
Thickness：5.6mm
Min.Hole Size：0.35mm
Min.line Width/Space：1.25mm
Inner Layer Copper Thickness：HOZ
Outer Layer Copper Thickness：1OZ
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.185mm
Factory：Shenzhen
1.2m Antenna Board
1.2m Antenna Board
Layers：2L
Thickness：0.6mm
Min.Hole Size：0.8mm
Min.line Width/Space：0.12mm
Inner Layer Copper Thickness：/
Outer Layer Copper Thickness：1OZ
Surface Finish： Immersion Tin
Min.Clearance of Hole to Line：/
Factory：Shenzhen
High Multilayer Backboard
High Multilayer Backboard
Layers：28L
Thickness：6.5mm
Min.Hole Size：0.7mm
Min.line Width/Space：0.1mm
Inner Layer Copper Thickness：1OZ
Outer Layer Copper Thickness： TOZ+
Surface Finish：ENIG
Min.Clearance of Hole to Line：0.18mm
Factory：Shenzhen
High-frequency Mix-lamination Board
High-frequency Mix-lamination Board
Layers：4L
Thickness：1.0mm
Min.Hole Size：0.2mm
Min.line Width/Space：0.127mm
Inner Layer Copper Thickness： 1OZ
Outer Layer Copper Thickness： 1.5OZ
Surface Finish：ENIG
Min.Clearance of Hole to Line： 0.2mm
Factory：Shenzhen
First-order Half Hole HDI Board
First-order Half Hole HDI Board
Layers：6L（1+4BV+1）
Thickness：0.6mm
Min.Hole Size：0.1mm
Min.line Width/Space：0.075mm/0.075mm
Inner Layer Copper Thickness：18μm
Outer Layer Copper Thickness：28μm
Surface Finish：ENIG
Min.Clearance of Hole to Line：0.18mm
Factory：Jiangsu
Through-hole Board
Through-hole Board
Layers：8L
Thickness：1.20mm
Min.Hole Size：0.25mm
Min.line Width/Space：0.081/0.127mm
Inner Layer Copper Thickness：H/H
Outer Layer Copper Thickness：15-33μm
Surface Finish：ENIG+OSP
Min.Clearance of Hole to Line：/
Factory： Jiangsu
<1234>