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HOME
ABOUT US
PCB
Automotive Products
Industrial Control Electronics
Consumer Electronics
Medical Appliance Electronics
Telecom Electronics
High Frequency Microwave Electronics
Special Electronics
PCB ASSEMBLY
FPGA BGA Assembly Patch
Intelligent Electronics
Medical PCB Board
Automotive
Consumer Electronics
MANUFACTURING TECHNOLOGY
Process Capability
Production Equipment
Testing Equipment
Inspection Equipment
Quality Assurance
System Certification
COMPANY
NEWS
CONTACT
English
简体中文
Deutsch
Español
Русский язык
بالعربية
PCB
Automotive Products
Industrial Control Electronics
Consumer Electronics
Medical Appliance Electronics
Telecom Electronics
High Frequency Microwave Electronics
Special Electronics
PCB
Multilayer Board
Layers:16L
Thickness:2.0mm
Min.Hole Size:0.2mm
Min.line Width/Space:0.08mm
Inner Layer Copper Thickness:HOZ
Outer Layer Copper Thickness:1OZ
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.16mm
Factory:Meizhou
R-FPC
Layers:8L
Thickness:0.8mm
Min.Hole Size:0.2mm
Min.line Width/Space:3.5/3mi
Inner Layer Copper Thickness:HOZ
Outer Layer Copper Thickness:1OZ
Surface Finish:ENIG
Min.Clearance of Hole to Line: 0.18mm
Factory: Meizhou
Through-hole Board
Layers:14L
Thickness:2.0mm
Min.Hole Size:0.25mm
Min.line Width/Space:0.1mm/0.1mm
Inner Layer Copper Thickness:18μm
Outer Layer Copper Thickness:35μm
Surface Finish: ENIG
Min.Clearance of Hole to Line:0.2mm
Factory:Jiangsu
First-order HDI Board
Layers:12L
Thickness:1.6mm
Min.Hole Size:0.45mm
Min.line Width/Space:0.09mm/0.1mm
Inner Layer Copper Thickness:18μm
Outer Layer Copper Thickness:25μm
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.18mm
Factory: Jiangsu
R-FPC
Layers:8L
Thickness:1.45mm
Min.Hole Size:0.25mm
Min.line Width/Space:5/3.6mil
Inner Layer Copper Thickness:HOZ
Outer Layer Copper Thickness:1OZ
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.25mm
Factory:Meizhou
Capacitive Touch Screen FPC
Layers:2L
Thickness:0.12mm
Min.Hole Size:0.1mm
Min.line Width/Space:0.05mm
Inner Layer Copper Thickness: 0.012mm
Outer Layer Copper Thickness:0.02mm
Surface Finish:ENIG
Min.Clearance of Hole to Line:0.1mm
Factory: Meizhou
Fingerprint Identification FPC
Layers:2L
Thickness:0.12mm
Min.Hole Size:0.1mm
Min.line Width/Space:0.05mm
Inner Layer Copper Thickness:0.012mm
Outer Layer Copper Thickness:0.02mm
Surface Finish:ENIG
Min.Clearance of Hole to Line: 0.1mm
Factory:Meizhou
Camera R-FPC (COB\HDI)
Layers:4L-6L
Thickness:0.3-0.4mm
Min.Hole Size:0.075mm
Min.line Width/Space:0.05mm
Inner Layer Copper Thickness:0.012mm
Outer Layer Copper Thickness:0.025mm
Surface Finish:ENEPIG
Min.Clearance of Hole to Line: 0.1mm
Factory:Meizhou
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